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2022 International Conference on IC Design and Technology (ICICDT)

On September 21 to 23, 2022, the ICICDT 2022 conference is co-sponsored by VNU Information Technology Institute – Vietnam National University, Hanoi and Le Quy Don Technical University. The conference is also technically supported by the IEEE Solid-State Circuits Vietnam Chapter, the IEICE Vietnam Section and the Radio-Electronics Association of Vietnam.

Design and technology co-optimization provide key advantage in the highly competitive market today. However, integrated circuit (IC) engineering traditionally separates design and technology and the two don’t use the same language, let alone understand each other. This is not a winning approach moving forward. Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one-to-one basis during the poster session.

Contributed papers are solicited in the following subject areas (but not limited to):

- Advanced materials and processing technologies, power semiconductor technologies and circuits;

- Advanced transistor and interconnect structures;

- Advanced packaging, heterogenous integration, lateral and vertical (2.5D/3D) integration;

- Variation and fault-tolerant designs, reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability;

- RF, analog, mixed signal, and I/O circuits for future technology generations;

- Simulation and modeling of advanced processes, devices, and circuits;

- Design for manufacturing, yield, and test, System-on-Chip (SoC) and System-in-Package (SiP) design integration;

- Emerging technologies, circuits and applications (MEMS, Memory, Internet of Things, Autonomous cars, Machine Learning, Artificial Intelligence).

 
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